Distinguished Professor Marek Osinski Receives DURIP Award to Obtain Flip-Chip-Bonder

October 21, 2022

Congratulations to Distinguished Professor Marek Osinski for winning an ONR/DURIP grant to purchase a flip-chip bonder for CHTM. This will be a significant enhancement to our materials fabrication capabilities.

The main components of the proposed system are the SETNA ACCμRA™100 high-accuracy flip-chip bonder, and the SETNA OntosTT 200-40 stand-alone atmospheric plasma instrument for surface preparation of parts to be bonded. The latter instrument is especially important to achieve reliability of the flip-chip process with indium, which oxidizes easily.

Although the main application for the ACCμRA™100 is flip-chip bonding, the machine can be used for many other applications, including micro assembly, diode laser and laser bar placement, VCSEL (vertical-cavity surface-emitting laser) and photodiode placement, light-emitting diode placement, chip-to-chip and chip-to-substrate bonding, multi-chip module packaging, 3D packaging, microelectromechanical systems, micro-optoelectromechanical systems, and
nanoimprinting (UV nanoimprint lithography and hot embossing). Apart from flip-chip bonding, the ACCμRA™100 can also perform die bonding and pick-and-place bonding through thermocompression, thermosonic, UV curing, or reflow processes. Bonding materials that can be used are gold, gold/tin, indium, copper, and UV or thermally cured adhesives.

This acquisition will significantly enhance UNM’s capabilities to conduct research and to educate scientists and engineers in the areas of integrated optoelectronics, microelectronics, and micro-electromechanical systems of critical importance to national defense. The initial research will be on optoelectronic integrated circuits incorporating strongly injection-locked microring lasers.

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